HSQ Resist - New Formulation!

EM Resist provides HSQ resist in both liquid and powder form. A high resolution negative tone electron beam resist with excellent etch properties.

H-SiOx (HSQ) is a high purity, silsesquioxane-based semiconductor grade polymer applicable as a negative tone resist for electron beam patterns, EUV, nanoimprint lithography and Step and Flash Imprint Lithography (SFIL). It is readily soluble in non-polar organic solvents like methyl isobutylketone (MIBK), methyl siloxane and toluene for thin-film fabrication. Depending on the film thickness, a dense pattern with sub-10 nm half-pitch can be achieved.

HSQ provided by EM Resist will replace any current product you might already use, like-for-like. If you would like to discuss about moving over to EM Resist for your HSQ requirements, please get in touch.

Both solution and powder kits can be shipped internationally.


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HSQ resist is a high resolution negative tone resist that has excellent etch resistance. Lithography can be performed with E-beam, EUV or SFIL.

We offer HSQ pre-diluted and filtered in MIBK, however we also have the option of a ‘dry-kit’. This consists of HSQ powder in a vial, a measure of MIBK and a syringe and syringe filter. This enables the user to perform custom dilutions as well as extend the shelf-life of the resist.

Specifications

  • Direct write and thin uniform films
  • High resolution (<10 nm features)
  • Excellent line edge roughness
  • Good dry etch resistance
  • Available in powder form to meet every need
  •  Improved shelf life of liquid form and very long shelf life at RT in powder form
  • Available in concentrations from 1% to 40%




Thin HSQ Spin Curves
HSQ 1%-6% Spin Curves


Thick HSQ Spin Curves
HSQ 10% - 20% Spin Curves